Location
South Plainfield, NJ | United States
Job description
Business Overview
MACDERMID ALPHA ELECTRONIC SOLUTIONS
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. MacDermid Alpha is a business unit of Element Solutions Inc (NYSE: ESI). Element Solutions Inc is a leading specialty chemicals company whose businesses supply a broad range of solutions that enhance the products people use every day.
SEMICONDUCTOR & ASSEMBLY SOLUTIONS (SAS)
As a global supplier to the semiconductor industry, we provide advanced copper interconnects, die attachment, wafer bump processes, solder technologies, fluxes, cleaners, and other attachment materials for the integrated circuit fabrication, semiconductor packaging, and electronic assembly industries. Our products touch nearly every facet of modern life and enable smart devices, phones, computers, electric vehicles, and more to function properly. SAS consists of three distinct business units (Circuit Board Assembly, Semiconductor Assembly, and Wafer Level Packaging) which are positioned to meet our customers’ everchanging needs. We operate globally, employ over 2,500 employees, and represent a $1.2BN (and growing) business.
Job Purpose
The purpose of this position is to drive the development of innovative, differentiated, and high-performance materials for the Semiconductor Assembly product lines comprised of polymer, composite and sintering technologies. The candidate will be responsible for developing new products, material testing strategies/protocols, formulations and modifying/optimizing existing products. In this role, the candidate will work closely with scientists, product managers, application, and marketing managers globally to execute new product development as well as create technology roadmaps and strategies in existing and adjacent markets that drive growth.
Job Responsibilities
- Hold self to the highest standards of safety. We are committed to building a strong safety culture in all laboratory and related activities.
- Drive innovation through the development of new adhesive technologies, processes, and products.
- Serve as the technical lead for adhesive development projects, guiding the team through the research, development, and testing phases.
- Develop an in-depth understanding of the patent and literature for new resin systems, chemistry, and polymers across related technology areas.
- Awareness and monitoring of the patent and technical documents is necessary to remain at the leading edge.
- Deliver presentations/reports that distill complex ideas into precise results and proposals; communicate appropriately to influence internal and external audiences.
- Stay updated with industry trends, emerging technologies, and best practices in adhesive development and semiconductor packaging
- Mentor and provide technical guidance to junior level scientists and technologists.
- Collaborate closely with cross-functional teams, providing technical guidance and support for adhesive-related projects.
- Actively participate in workgroup team meetings to address safety, process improvement, problem-solving, and other workgroups, departments, and active topics.
- Leverage external networks for project success, establish relationships with customer/OEM, and regularly engage in appropriate scientific venues.
- Ability to work in a high paced and multi-task environment. Self-motivated and able to work with minimal supervision.
Requirements & Qualifications
- Ph.D. in Materials Science, Chemistry, Chemical Engineering, or a related field with a strong focus on adhesives and polymers.
- Ideally 5+ years of industrial experience in adhesive research and development, with a proven track record of delivering innovative solutions for consumer electronics or semiconductor assembly applications or equivalent experience
- Possess good synthesis background of monomers and polymers especially thermoset materials such as acrylics, epoxies and polyurethanes.
- In-depth knowledge of semiconductor packaging processes and materials is a plus.
- Hands-on experience in conducting comprehensive thermal, physical, and mechanical properties characterization, including but not limited to DMA, TMA, Rheology, GPC, and more.
- Utilize structure-property relationships to link material properties to product performance and use this understanding to drive product development.
- A collaborative mindset and the ability to work effectively in a team environment.
- Organized, self-motivated, and action-oriented, with the ability to adapt quickly to new challenges and opportunities.
- Demonstrated technical accomplishments, including patents and journals, in adhesive development.
- Strong verbal and written communication skills; Adept at effectively and concisely conveying technical information to various stake holders, conducting engineering, sales and marketing.
EEO Statement
Equal Opportunity Employer: Minority/Female/Veteran/Disabled – E-Verify Company
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