Principal Wafer Level Packaging Engineer
Location
Stockton on Tees, County Durham | United Kingdom
Job description
Principal Wafer Level Packaging Engineer
Do you want to play a key role in driving forward Pragmatic’s emerging technology? If are driven, ambitious and have a strong background in semiconductor packaging, we would love to hear from you!
We usually respond within a week
Overview
Pragmatic is seeking an experienced Packaging Development Engineer to join its expanding R&D team in Sedgefield. The Principal Wafer Level Packaging Engineer will be responsible for leading and coordinating wafer level packaging research and development activities for non-RFID applications, driving our internal roadmap and working closely with the Foundry, Operations and Process Engineering teams as well as external development partners.
Key tasks
- Lead FlexIC’s wafer level packaging development activities.
- Successfully develop and demonstrate FlexIC wafer packaging solutions
- Develop assembly technologies for Flexible Hybrid Electronics (FHE) applications.
- Day to day management, coordination and decision making related to packaging development activities
Qualifications and training
- Degree or post-graduate in electronics, mechanical engineering, electronics engineering, MEMS or another relevant discipline; or equivalent experience.
Skills and experience
- Experience with semiconductor packaging techniques including electroplating, redistribution layers, wafer bumping etc
- Experience with semiconductor, MEMs and flexible electronics assembly techniques including direct die attach, flip chip, thermo bonding, solder, wire bonding etc
- Experience with R2R and mechanical transfer processes (advantage)
- Experience in leading development projects interacting with internal and external stakeholders
- Knowledge and understanding of semiconductor fabrication techniques
- Ability to work to tight deadlines and progress multiple projects simultaneously
- Strong communication skills, interpersonal within theteam and external facing
- Ability to work independently and part of a team.
At Pragmatic, we have a highly skilled, passionate and driven team from diverse backgrounds. We have employees from over a dozen countries, covering 5 continents. The company culture is one that promotes an open and collaborative environment where everyone’s input is valued. Our employees feel fortunate to work in such an innovative and inspiring place, with a talented and dedicated team all focused on reinventing electronics to address real world challenges.
Principal Wafer Level Packaging Engineer
Do you want to play a key role in driving forward Pragmatic’s emerging technology? If are driven, ambitious and have a strong background in semiconductor packaging, we would love to hear from you!
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