IFCI LIMITED
Location
New Delhi | India
Job description
Name of Position:
Sr Associate- Technical (India Semiconductor Mission (ISM)) (On Contract) No. of Positions: 02 (UR) - [1 for semiconductor fabrication and semiconductor packaging (ATMP/OSAT), 1 for display fabrication and semiconductor packaging (ATMP/OSAT)]. Qualification : B.E/B. Tech. or equivalent (in Electronics/ Electronics & Communication/ Electronics & Instrumentation)/ M.Tech/MS/MSc/PhD, from a recognized University. Any other additional qualification pertaining to semiconductors/displays manufacturing/semiconductor packaging will be preferred. Experience & Skills required: · Minium post-qualification experience required in the electronics industry/ Semiconductor/ display/ semiconductor packaging industry is as under: o For B.E/B. Tech. or equivalent in Electronics/ Electronics & Communication/ Electronics & Instrumentation - Minimum 10 years of post-qualification experience. o For M.Tech/MS/MSc- Minimum 08 Years of post-qualification experience. o For M.Tech/MS/MSc with PhDs- Minimum 06 Years of post-qualification experience · In depth understanding of the semiconductor ecosystem, including semiconductor fabrication, display fabrication, compound semiconductors, semiconductor Assembly, Testing, Marking and Packaging (ATMP), Outsourced Semiconductor Assembly and Test (OSAT) required with 6 years experience in the electronics industry/Semiconductor/display/semiconductor packaging industry/R&D. · Relevant experience in semiconductor/display manufacturing/ semiconductor packaging. · Understanding the supply chain resilience and risk associated with it. · Basic understanding of Project Financing. · Good grasp on CMOS technologies and its flavours. · Understanding of key elements of technology transfer process (Copy Exact, Copy Smart). · Understanding of Bill of Materials (BOM) for semiconductor FAB and ATMP. Key Objectives and Responsibilities: ·· Formulate a comprehensive long-term strategy for developing a sustainable semiconductor, display manufacturing and semiconductor packaging ecosystem in the country. · Examine the technical and financial viability of the proposals under the Semicon India Program. · Facilitate the adoption of secure microelectronics and develop a trusted semiconductor, display and packaging supply chain. · Review the disbursement requests raised by the applicants to whom the grant of incentives has been approved as per agreed milestones. · Creating a Benchmarking database for FAB and ATMP plant and Machinery · Encourage relevant R&D activities in semiconductors, display and packaging industry spheres taking into consideration the latest developments. · Recommend suitable courses/ programs to facilitate the development of a skilled talent pool in semiconductor, display and packaging segments. Remuneration: Market driven salary which will not be a constraint for a suitable candidate. HOW TO APPLY: Candidates fulfilling the above eligibility criteria may submit their Resume/Biodata through email at [email protected]. Kindly enclose the self-attested photocopies of the following documents in the email: Proof of date of Birth Educational Certificates Relevant Experience certificates (containing areas and period of service) Note: LAST DATE FOR SUBMISSION THROUGH E-MAIL IS MARCH 15, 2024.Job tags
Salary
