Lead Technician Wafer Technology / Microelectronic (f/m/div)
Location
Dresden | Germany
Job description
Are you ready to take on the challenge of overseeing product transfer, identify and address yield issues, and ensure stable production cycles? As Technical Lead, you will use your deep understanding of Front End Wafer Technology Processes and experience in technical leadership to ensure stable and high-quality production cycles.
In your new role you will:
- Successfully transfer a product portfolio from a partner site to Infineon Dresden
- Serve as the single point of contact for Test Development and Wafer-Test for these products
- Act as the project lead to enable Infineon Dresden as the single source for this product portfolio
- Oversee product-related topics at Wafer-Test such as test package availability, data processing, and data post-processing
- Identify and address yield issues along the supply chain caused by Design, Test or Technology
- Assess trial runs, initiate and drive yield improvement actions , and support Product Engineering to provide yield road maps
Your Profile
We develop robust technologies, ensuring stability and quality through immediate deviation detection, fast root cause understanding, and sustainable corrective action implementation throughout the production cycle. To achieve this, we seek your creativity to find solutions that can react quickly and accurately to different technical challenges. You should be able to convince people with your analytical ideas and excellent communication and presentation skills. As a technical leader, you are open to others’ input, which might be necessary for finding the perfect solution.
You are best equipped for this task if you have:
- A Phd or Master/Diploma in physics, electrical engineering, or any microelectronic related field
- At least 7 years of experience in device physics, volume data analyses, statistical methods and design of experiment , with a very good understanding of product and technology development flows
- A deep understanding of the Front End Wafer Technology Processes , ideally in 130nm and 90nm integrated CMOS and/or BCD technologies
- Experience in technically leading small teams
- Preferably some experience in collaboration within cross functional, multicultural project teams
- Very good English and German language skills
Job tags
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